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Open AccessArticle

Crack-Resistance Behavior of an Encapsulated, Healing Agent Embedded Buffer Layer on Self-Healing Thermal Barrier Coatings

1
Department of Energy Engineering, Hanyang University, Seoul 133-791, Korea
2
School of Materials Science and Engineering, Changwon National University, Changwon, Gyeongnam 641-773, Korea
3
High Temperature Materials Research Group, Korea Institute of Materials Science, 797 Changwondaero, Changwon, Gyeongnam 641-831, Korea
4
Department of Mechanical and Energy Engineering, Indiana University–Purdue University Indianapolis, Indianapolis, IN 46202-5132, USA
*
Authors to whom correspondence should be addressed.
Coatings 2019, 9(6), 358; https://doi.org/10.3390/coatings9060358
Received: 3 May 2019 / Revised: 27 May 2019 / Accepted: 29 May 2019 / Published: 31 May 2019
(This article belongs to the Special Issue Science and Technology of Thermal Barrier Coatings)
In this work, a novel thermal barrier coating (TBC) system is proposed that embeds silicon particles in coating as a crack-healing agent. The healing agent is encapsulated to avoid unintended reactions and premature oxidation. Thermal durability of the developed TBCs is evaluated through cyclic thermal fatigue and jet engine thermal shock tests. Moreover, artificial cracks are introduced into the buffer layer’s cross section using a microhardness indentation method. Then, the indented TBC specimens are subject to heat treatment to investigate their crack-resisting behavior in detail. The TBC specimens with the embedded healing agents exhibit a relatively better thermal fatigue resistance than the conventional TBCs. The encapsulated healing agent protects rapid large crack openings under thermal shock conditions. Different crack-resisting behaviors and mechanisms are proposed depending on the embedding healing agents. View Full-Text
Keywords: crack healing; encapsulation; healing agent; thermal barrier coating; thermal durability crack healing; encapsulation; healing agent; thermal barrier coating; thermal durability
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MDPI and ACS Style

Song, D.; Song, T.; Paik, U.; Lyu, G.; Jung, Y.-G.; Choi, B.-G.; Kim, I.-S.; Zhang, J. Crack-Resistance Behavior of an Encapsulated, Healing Agent Embedded Buffer Layer on Self-Healing Thermal Barrier Coatings. Coatings 2019, 9, 358.

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