Silver Nanowire-Based Flexible Transparent Electrodes: Fabrication and Applications
Abstract
1. Introduction
2. Post-Treatment Techniques for Reducing the Contact Resistance
2.1. Thermal Annealing
2.2. Photonic Sintering
2.3. Laser Sintering
2.4. Electrodeposition Welding
3. Protective Coating Layers for Improving Stability
3.1. Metal Oxides
3.2. Noble Metals
3.3. PEDOT:PSS
4. Applications
4.1. OLEDs
4.2. Heaters
4.3. Electrochromic Devices
5. Conclusions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
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| Method | Refs. | Processing Condition | Sheet Resistance/Transmittance | FOM | Compatibility and Scalability | Stability/Durability | Advantages and Limitations |
|---|---|---|---|---|---|---|---|
| Thermal annealing | Lee et al. [93]; Lagrange et al. [94] | Thermal treatment at ca. 200 °C; optimized annealing of AgNW networks. | Rs decreased from >1 kΩ sq−1 to ca. 100 Ω sq−1 after 20 min; optimized electrodes can reach 16 Ω sq−1 at 86% T or 2.9–9.5 Ω sq−1 depending on network density and wire geometry. | ca. 0.014–0.11 Ω−1, depending on T/Rs combination. | Simple and scalable heating process, but only moderately compatible with flexible substrates; high temperature may damage PET or other low-Tg polymers. | Excessive annealing may cause AgNW degradation, spheroidization, or increased resistance. | Advantage: simple, low-cost and chemical-free. Limitation: strict temperature/time control and limited compatibility with heat-sensitive substrates. |
| Photonic sintering/plasmonic welding | Garnett et al. [95]; Gerlein et al. [96] | Broadband light or pulsed photonic irradiation; plasmon-induced localized heating at AgNW junctions. | 9.81 Ω sq−1 at 88.27% T. | 0.031 Ω−1. | Good compatibility with flexible substrates because heating is localized at junctions; suitable for high-speed and roll-to-roll processing. | Junction resistance can decrease by more than three orders of magnitude after plasmonic welding; rapid treatment improves network conductivity. | Advantage: rapid, non-contact and large-area compatible. Limitation: pulse energy, exposure time and nanowire density must be carefully optimized. |
| Laser welding | Dai et al. [97]; Nian et al. [98]; Wang et al. [99]; Hu et al. [100] | Continuous-wave, nanosecond or femtosecond laser irradiation; localized melting/recrystallization at AgNW junctions. | 16.1 Ω sq−1 at 91% T. | ca. 0.024 Ω−1. | Good substrate compatibility under optimized laser parameters; more suitable for patterned or local treatment than whole-area low-cost processing. | Stable after 10,000 bending cycles; stable for 30 days at 85 °C and 85% RH in the reported femtosecond-laser-welded film. | Advantage: high spatial precision and improved adhesion/uniformity. Limitation: relatively high equipment cost and scanning-dependent throughput. |
| Ni electrodeposition welding | Eom et al. [101]; Wang et al. [102] | Ni electroplating on AgNW networks; representative deposition time of 5–100 s. | Pristine AgNW: 31.07 Ω sq−1, 85.27% T. After 5, 20, 50 and 100 s Ni deposition: 28.98, 26.03, 21.09 and 9.92 Ω sq−1; T decreases to 81.41%, 74.99%, 48.66% and 37.01%, respectively. | Reported FoM values: 72.62 for pristine AgNW; 60.04, 46.79, 20.62 and 29.51 after 5, 20, 50 and 100 s deposition, respectively. | Solution-based process compatible with flexible substrates when electrolyte and deposition time are controlled; scalable but needs electrochemical equipment. | After 14 days at 80 °C/85% RH, Ni-coated samples showed only 1.18–1.54-fold resistance increase; one sample showed only 6.44-fold increase after 300 s in Na2S solution. | Advantage: reduces junction resistance and improves oxidation/sulfurization resistance. Limitation: excessive Ni deposition strongly reduces optical transparency. |
| Ag epitaxial electrodeposition | Kang et al. [81] | Roll-to-roll galvanostatic Ag electroplating; epitaxial Ag growth on AgNWs and junctions. | ca. 19 Ω sq−1 at 90% T550. | ca. 0.018 Ω−1. | Good compatibility with PET-based flexible electrodes; roll-to-roll electroplating demonstrates high scalability. | Improves junction bonding and network integrity; applied to OLEDs, triboelectric nanogenerators and resistive touch panels. | Advantage: smooth Ag deposition reduces junction resistance while maintaining transparency. Limitation: excessive Ag growth may reduce transparency and requires precise process control. |
| Au shell/Ag@Au structure | Zhang et al. [103]; Zhu et al. [104]; Seong et al. [105] | Au coating or ultrathin epitaxial Ag@Au core–shell nanowire formation; Au shell thickness typically only several nanometers. | 9.88 Ω sq−1 at 85% T; 17.52 Ω sq−1 at 90% T; 37.41 Ω sq−1 at 95% T. | ca. 0.020 Ω−1 at 90% T and 17.52 Ω sq−1. | Good compatibility with flexible PET after transfer; solution synthesis is feasible, but Au cost should be considered for scale-up. | No significant Rs change for 84 days at 80 °C/100% humidity; stable in PBS for more than 21 days and in air for more than 6 months. | Advantage: excellent chemical, thermal and humidity stability. Limitation: high noble-metal cost and possible optical/plasmonic loss if the Au layer is too thick. |
| Self-limited nanosoldering | Huang et al. [92] | Room-temperature self-limited nanosoldering through selective Ag nanosolder deposition at AgNW junctions. | AgNW film decreased from 18.6 to 7.7 Ω sq−1 at 90% T; heater electrode reached 3.7 Ω sq−1 at 82.5% T. | ca. 0.045 Ω−1 at 90% T and 7.7 Ω sq−1; ca. 0.039 Ω−1 for heater electrode. | Good compatibility with flexible substrates because the process occurs at room temperature; large-area 210 × 297 mm2 electrodes were demonstrated. | Transparent heater reached 145 °C at 6 V within 30 s with a heating rate of 4.8 °C s−1. | Advantage: room-temperature, simple and effective for transparent heaters. Limitation: optical transmittance decreases when very low sheet resistance is targeted. |
| Metal oxide nanoparticle modification | Liu et al. [106] | Modification of AgNW networks with ZnO, SnO2, Al2O3 or TiO2 nanoparticles generated by magnetron sputtering. | Resistance reduction: 75.6% for ZnO, 70.4% for SnO2, 53.2% for Al2O3 and 59.8% for TiO2 modification. Exact comparable T/Rs values depend on oxide type and thickness. | Not reported using the same FOM format. | Compatible with flexible transparent conductive films; sputtering is scalable but requires vacuum equipment. | Failure voltage increased up to 16 V; temperature non-uniformity decreased to 8.7%–10.4% compared with 40.6% for pristine AgNW films. | Advantage: improves electrical uniformity, thermal distribution and current-loading stability. Limitation: vacuum equipment and thickness control are required. |
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Cao, G.; Liang, H.; Xiong, J.; Huang, T.; Yang, M.; Zhang, H.; Wang, Z. Silver Nanowire-Based Flexible Transparent Electrodes: Fabrication and Applications. Coatings 2026, 16, 704. https://doi.org/10.3390/coatings16060704
Cao G, Liang H, Xiong J, Huang T, Yang M, Zhang H, Wang Z. Silver Nanowire-Based Flexible Transparent Electrodes: Fabrication and Applications. Coatings. 2026; 16(6):704. https://doi.org/10.3390/coatings16060704
Chicago/Turabian StyleCao, Ge, Haixian Liang, Jiali Xiong, Tianhong Huang, Min Yang, He Zhang, and Zhenyu Wang. 2026. "Silver Nanowire-Based Flexible Transparent Electrodes: Fabrication and Applications" Coatings 16, no. 6: 704. https://doi.org/10.3390/coatings16060704
APA StyleCao, G., Liang, H., Xiong, J., Huang, T., Yang, M., Zhang, H., & Wang, Z. (2026). Silver Nanowire-Based Flexible Transparent Electrodes: Fabrication and Applications. Coatings, 16(6), 704. https://doi.org/10.3390/coatings16060704
