Simulation Study on Contact Stress at Copper Busbar Surface Microstructures and Polymer Interfaces
Highlights
- Arc and trapezoidal microstructures reduce Cu-polymer interfacial contact stress by up to 20% (PPS > PP).
- The arc-shaped surface outperforms the trapezoidal surface, lowering PP valley stress by 10.9% (0.679 → 0.605 MPa).
- Optimal parameters: arc width 1.0 mm/depth 0.8 mm; trapezoidal base 2.0 mm/height 1.2 mm.
- RSM confirms high model significance (p < 0.0001, R2 > 0.98) and simulation reliability.
- The findings provide design guidelines for metal–polymer interfaces in high-voltage connectors.
- They enable stress reduction via microstructure optimization without changing materials.
- They establish a simulation-RSM validation method to enhance simulation trustworthiness.
- They support reliability improvement of insulation coatings for EV copper busbars.
Abstract
1. Introduction
2. Materials and Methods
2.1. Physical Model Establishment
2.2. Material Properties
2.3. Design of Copper Surface Microstructures
2.4. Response Surface Experimental Design
3. Results and Discussion
3.1. Influence of Arc-Shaped Structure on Interfacial Contact Stress
3.2. Influence of Trapezoidal Structure on Interfacial Contact Stress
3.3. Response Surface Validation
Response Surface Model Construction
3.4. Validation of Optimal Parameters
4. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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| Material | Attribute | |||
|---|---|---|---|---|
| Density (kg·m−3) | Poisson’s Ratio | CTE (10−6/K) | Young’s Modulus (GPa) | |
| Cu | 8960 | 0.345 | 16.5 | 110 |
| PP | 900 | 0.425 | 124 | 1.5 |
| PPS | 1660 | 0.38 | 25 | 16 |
| Factor | Level | ||
|---|---|---|---|
| −1 | 0 | 1 | |
| A/Arc width | 0.05 | 0.525 | 1.0 |
| B/Arc depth | 0.1 | 0.55 | 1.0 |
| Factor | Level | ||
|---|---|---|---|
| −1 | 0 | 1 | |
| A/Trapezoidal bottom base length | 0.05 | 0.525 | 1.0 |
| B/Trapezoidal height | 0.1 | 0.55 | 1.0 |
| Level | Factor | |||||
|---|---|---|---|---|---|---|
| x1/mm | x2/mm | y1/mm | y2/mm | |||
| 1 | 0.05 | 0.1 | 0.532 | 0.1 | 0.2 | 0.538 |
| 2 | 0.05 | 1.0 | 0.528 | 0.1 | 1.5 | 0.522 |
| 3 | 1.0 | 0.1 | 0.515 | 2.0 | 0.2 | 0.513 |
| 4 | 1.0 | 1.0 | 0.498 | 2.0 | 1.5 | 0.501 |
| 5 | 0.05 | 0.55 | 0.526 | 0.1 | 0.85 | 0.529 |
| 6 | 1.0 | 0.55 | 0.502 | 2.0 | 0.85 | 0.506 |
| 7 | 0.525 | 0.1 | 0.521 | 1.05 | 0.2 | 0.525 |
| 8 | 0.525 | 1.0 | 0.505 | 1.05 | 1.5 | 0.509 |
| 9 | 0.275 | 0.325 | 0.524 | 0.575 | 0.525 | 0.531 |
| 10 | 0.775 | 0.775 | 0.501 | 1.525 | 1.175 | 0.504 |
| 11 | 0.525 | 0.55 | 0.510 | 1.05 | 0.85 | 0.517 |
| 12 | 0.525 | 0.55 | 0.508 | 1.05 | 0.85 | 0.515 |
| 13 | 0.525 | 0.55 | 0.511 | 1.05 | 0.85 | 0.516 |
| Experiment | Sum of Squares | Degrees of Freedom | Mean Square | F | p |
|---|---|---|---|---|---|
| Model | 0.0126 | 5 | 0.0025 | 68.32 | <0.0001 |
| x1 | 0.0038 | 1 | 0.0038 | 103.26 | <0.0001 |
| x2 | 0.0029 | 1 | 0.0029 | 79.15 | <0.0001 |
| x12 | 0.0021 | 1 | 0.0021 | 57.83 | <0.0001 |
| x22 | 0.0018 | 1 | 0.0018 | 49.17 | <0.0001 |
| x1x2 | 0.0004 | 1 | 0.0004 | 10.89 | 0.0231 |
| Residual sum | 0.0003 | 7 | 0.0004 | ||
| Total sum | 0.0129 | 12 |
| Experiment | Sum of Squares | Degrees of Freedom | Mean Square | F | p |
|---|---|---|---|---|---|
| Model | 0.0108 | 5 | 0.00216 | 59.47 | <0.0001 |
| y1 | 0.0032 | 1 | 0.0032 | 87.65 | <0.0001 |
| y2 | 0.0025 | 1 | 0.0025 | 68.43 | <0.0001 |
| y12 | 0.0019 | 1 | 0.0019 | 52.18 | <0.0001 |
| y22 | 0.0016 | 1 | 0.0016 | 44.09 | <0.0001 |
| y1y2 | 0.0003 | 1 | 0.0003 | 8.27 | 0.0315 |
| Residual sum | 0.00026 | 7 | 0.000037 | ||
| Total sum | 0.01106 | 12 |
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Zhao, M.; Wen, Y.; Xiao, C.; Hai, F.; Wu, H. Simulation Study on Contact Stress at Copper Busbar Surface Microstructures and Polymer Interfaces. Coatings 2026, 16, 638. https://doi.org/10.3390/coatings16060638
Zhao M, Wen Y, Xiao C, Hai F, Wu H. Simulation Study on Contact Stress at Copper Busbar Surface Microstructures and Polymer Interfaces. Coatings. 2026; 16(6):638. https://doi.org/10.3390/coatings16060638
Chicago/Turabian StyleZhao, Mengfu, Yiming Wen, Changle Xiao, Fei Hai, and Hongyan Wu. 2026. "Simulation Study on Contact Stress at Copper Busbar Surface Microstructures and Polymer Interfaces" Coatings 16, no. 6: 638. https://doi.org/10.3390/coatings16060638
APA StyleZhao, M., Wen, Y., Xiao, C., Hai, F., & Wu, H. (2026). Simulation Study on Contact Stress at Copper Busbar Surface Microstructures and Polymer Interfaces. Coatings, 16(6), 638. https://doi.org/10.3390/coatings16060638

