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Journal: Coatings, 2025
Volume: 15
Number: 1489
1489
Article: Adhesion Improvement Between Cu-Etched Commercial Polyimide/Cu Foils and Biopolymers for Sustainable In-Mold Electronics
Authors: by Zahra Fazlali, David Schaubroeck, Maarten Cauwe, Karen Leus, Rino Morent, Nathalie De Geyter, Ludwig Cardon, Pieter Bauwens and Jan Vanfleteren
Link: https://www.mdpi.com/2079-6412/15/12/1489

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