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Volume 14
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10.3390/coatings14050613
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Article

Optimizing Nickel Electroplating in Low-Ni Environments for Efficient Source Production in Small Plating Baths

by
Gujin Kang
1,2,
Jongbum Kim
1,
Jin Kim
1,
Jinjoo Kim
1,
Jintae Hong
1 and
Sangwook Kim
2,*
1
Radioisotope Research Division, Korea Atomic Energy Research Institute, 111, 989 beongil, Daejeon 34057, Republic of Korea
2
Department of Advanced Materials Chemistry, Dongguk University, 123 Dongdaero, Gyeongju 38066, Republic of Korea
*
Author to whom correspondence should be addressed.
Coatings 2024, 14(5), 613; https://doi.org/10.3390/coatings14050613
Submission received: 30 March 2024 / Revised: 10 May 2024 / Accepted: 10 May 2024 / Published: 12 May 2024
(This article belongs to the Section Surface Characterization, Deposition and Modification)
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Abstract

Electroplating nickel-63, a radioactive isotope used in betavoltaic batteries and random number generators, requires precise control due to its limited availability and the generation of radioactive waste. To minimize waste and ensure effective plating, small plating baths are employed, optimizing the process within constrained conditions. X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS) were utilized to determine the optimal plating conditions and limiting conditions for nickel electroplating in a small plating bath. This study focuses on the use of low-concentration nickel solutions and small plating equipment, in contrast to the common industrial practice of using high concentrations of nickel. Here, it is important to optimize the plating parameters, especially the nickel concentration, current density, and bath temperature. An average thickness of 1.8 μm was found when plating with a nickel concentration of 0.06 M, a current density of 5 mA/cm2, and a solution temperature of 40 °C, while ideal conditions were found to achieve the theoretical maximum energy and 90% release rate when plating with nickel-63 instead of Ni.
Keywords: nickel electroplating; betavoltaic battery; radioisotope nickel electroplating; betavoltaic battery; radioisotope

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MDPI and ACS Style

Kang, G.; Kim, J.; Kim, J.; Kim, J.; Hong, J.; Kim, S. Optimizing Nickel Electroplating in Low-Ni Environments for Efficient Source Production in Small Plating Baths. Coatings 2024, 14, 613. https://doi.org/10.3390/coatings14050613

AMA Style

Kang G, Kim J, Kim J, Kim J, Hong J, Kim S. Optimizing Nickel Electroplating in Low-Ni Environments for Efficient Source Production in Small Plating Baths. Coatings. 2024; 14(5):613. https://doi.org/10.3390/coatings14050613

Chicago/Turabian Style

Kang, Gujin, Jongbum Kim, Jin Kim, Jinjoo Kim, Jintae Hong, and Sangwook Kim. 2024. "Optimizing Nickel Electroplating in Low-Ni Environments for Efficient Source Production in Small Plating Baths" Coatings 14, no. 5: 613. https://doi.org/10.3390/coatings14050613

APA Style

Kang, G., Kim, J., Kim, J., Kim, J., Hong, J., & Kim, S. (2024). Optimizing Nickel Electroplating in Low-Ni Environments for Efficient Source Production in Small Plating Baths. Coatings, 14(5), 613. https://doi.org/10.3390/coatings14050613

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