Kang, G.; Kim, J.; Kim, J.; Kim, J.; Hong, J.; Kim, S.
Optimizing Nickel Electroplating in Low-Ni Environments for Efficient Source Production in Small Plating Baths. Coatings 2024, 14, 613.
https://doi.org/10.3390/coatings14050613
AMA Style
Kang G, Kim J, Kim J, Kim J, Hong J, Kim S.
Optimizing Nickel Electroplating in Low-Ni Environments for Efficient Source Production in Small Plating Baths. Coatings. 2024; 14(5):613.
https://doi.org/10.3390/coatings14050613
Chicago/Turabian Style
Kang, Gujin, Jongbum Kim, Jin Kim, Jinjoo Kim, Jintae Hong, and Sangwook Kim.
2024. "Optimizing Nickel Electroplating in Low-Ni Environments for Efficient Source Production in Small Plating Baths" Coatings 14, no. 5: 613.
https://doi.org/10.3390/coatings14050613
APA Style
Kang, G., Kim, J., Kim, J., Kim, J., Hong, J., & Kim, S.
(2024). Optimizing Nickel Electroplating in Low-Ni Environments for Efficient Source Production in Small Plating Baths. Coatings, 14(5), 613.
https://doi.org/10.3390/coatings14050613