Liu, H.; Hua, Y.; Li, W.; Hou, Z.; Dong, J.; Liu, Y.
Effect of Trace Bismuth on Deformation Behavior of Ultrahigh-Purity Copper during Hot Compression. Coatings 2024, 14, 1261.
https://doi.org/10.3390/coatings14101261
AMA Style
Liu H, Hua Y, Li W, Hou Z, Dong J, Liu Y.
Effect of Trace Bismuth on Deformation Behavior of Ultrahigh-Purity Copper during Hot Compression. Coatings. 2024; 14(10):1261.
https://doi.org/10.3390/coatings14101261
Chicago/Turabian Style
Liu, Haitao, Yunxiao Hua, Weiqiang Li, Zhenguo Hou, Jincan Dong, and Yong Liu.
2024. "Effect of Trace Bismuth on Deformation Behavior of Ultrahigh-Purity Copper during Hot Compression" Coatings 14, no. 10: 1261.
https://doi.org/10.3390/coatings14101261
APA Style
Liu, H., Hua, Y., Li, W., Hou, Z., Dong, J., & Liu, Y.
(2024). Effect of Trace Bismuth on Deformation Behavior of Ultrahigh-Purity Copper during Hot Compression. Coatings, 14(10), 1261.
https://doi.org/10.3390/coatings14101261