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Volume 13
Issue 9
10.3390/coatings13091597
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Article

Using an Interlayer to Toughen Flexible Colorless Polyimide-Based Cover Windows

by
Yusuke Matsuda
1,*,
Yinjie Cen
2,
Luke Bu
2,
Jieqian Zhang
2,
Kostantinos Kourtakis
1,
Tao Huang
2,
Yixuan Song
1,
Mobin Yahyazadehfar
1,
Derek Caputo
3,
John Podhiny
3,
Leopoldo Carbajal
1 and
Aref Samadi-Dooki
1,*
1
DuPont, Wilmington, DE 19803, USA
2
DuPont, Marlborough, MA 01752, USA
3
Materials Research & Design, Inc., Wayne, PA 19087, USA
*
Authors to whom correspondence should be addressed.
Coatings 2023, 13(9), 1597; https://doi.org/10.3390/coatings13091597
Submission received: 28 July 2023 / Revised: 24 August 2023 / Accepted: 7 September 2023 / Published: 13 September 2023
(This article belongs to the Special Issue Polymer Films/Membranes: Structure, Properties, and Applications)
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Abstract

Colorless polyimide (PI)-based flexible cover windows are a critical component of flexible electronics to protect devices from unwanted chemical and mechanical damage. The integration of flexible colorless PI-based windows into electronics applications is limited by the embrittlement of some colorless PI films when they are coated with hard coats. Here, we investigate the embrittlement mechanism of hard-coated colorless PI films and the role of interlayers in toughening the colorless PI-based cover windows for flexible electronics applications. A fracture mechanics approach combined with finite element analysis (FEA) models is employed to compute fracture strain, εc, for different crack cases in the bilayer (hard coated colorless PI) and trilayer (with an additional interlayer) cover windows. For the model inputs and validation, the material properties of the cover windows are characterized. We show that the embrittlement is attributed to the fracture behavior of the cover windows, and placing a ductile interlayer increases the εc of colorless PI films. Using the fracture analysis as a design guide, we fabricate a trilayer cover window with an acrylic thermoset interlayer and demonstrate an improvement of the εc of the colorless PI cover window by ~42%. We believe our analysis provides insights into design guides for mechanically robust cover windows using colorless PI films and flexible HCs for emerging flexible electronics.
Keywords: colorless polyimide film; flexible hard coat; flexible cover window; foldable and flexible electronics; fracture mechanics colorless polyimide film; flexible hard coat; flexible cover window; foldable and flexible electronics; fracture mechanics

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MDPI and ACS Style

Matsuda, Y.; Cen, Y.; Bu, L.; Zhang, J.; Kourtakis, K.; Huang, T.; Song, Y.; Yahyazadehfar, M.; Caputo, D.; Podhiny, J.; et al. Using an Interlayer to Toughen Flexible Colorless Polyimide-Based Cover Windows. Coatings 2023, 13, 1597. https://doi.org/10.3390/coatings13091597

AMA Style

Matsuda Y, Cen Y, Bu L, Zhang J, Kourtakis K, Huang T, Song Y, Yahyazadehfar M, Caputo D, Podhiny J, et al. Using an Interlayer to Toughen Flexible Colorless Polyimide-Based Cover Windows. Coatings. 2023; 13(9):1597. https://doi.org/10.3390/coatings13091597

Chicago/Turabian Style

Matsuda, Yusuke, Yinjie Cen, Luke Bu, Jieqian Zhang, Kostantinos Kourtakis, Tao Huang, Yixuan Song, Mobin Yahyazadehfar, Derek Caputo, John Podhiny, and et al. 2023. "Using an Interlayer to Toughen Flexible Colorless Polyimide-Based Cover Windows" Coatings 13, no. 9: 1597. https://doi.org/10.3390/coatings13091597

APA Style

Matsuda, Y., Cen, Y., Bu, L., Zhang, J., Kourtakis, K., Huang, T., Song, Y., Yahyazadehfar, M., Caputo, D., Podhiny, J., Carbajal, L., & Samadi-Dooki, A. (2023). Using an Interlayer to Toughen Flexible Colorless Polyimide-Based Cover Windows. Coatings, 13(9), 1597. https://doi.org/10.3390/coatings13091597

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