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Journal: Coatings, 2023
Volume: 13
Number: 285
Article:
Investigation of the Microstructure, Thermal Properties, and Mechanical Properties of Sn-Bi-Ag and Sn-Bi-Ag-Si Low Temperature Lead-Free Solder Alloys
Authors:
by
Sheng Chen, Xinbao Wang, Zhiqiu Guo, Changjun Wu, Yongxiong Liu, Ya Liu and Xuping Su
Link:
https://www.mdpi.com/2079-6412/13/2/285
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