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Journal: CoatingsVolume: 13Number: 285
Article: Investigation of the Microstructure, Thermal Properties, and Mechanical Properties of Sn-Bi-Ag and Sn-Bi-Ag-Si Low Temperature Lead-Free Solder Alloys
- Authors:
- Sheng Chen1,†,
- Xinbao Wang1,† and
- Zhiqiu Guo2,*
- et al.
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