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Open AccessArticle

Investigation of Wettability, Drying and Water Condensation on Polyimide (Kapton) Films Treated by Atmospheric Pressure Air Dielectric Barrier Discharge

Department of Macromolecular Physics, Faculty of Mathematics and Physics, Charles University, V Holešovickách 2, 18000 Praha 8, Czech Republic
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Author to whom correspondence should be addressed.
Coatings 2020, 10(7), 619; https://doi.org/10.3390/coatings10070619
Received: 4 June 2020 / Revised: 24 June 2020 / Accepted: 28 June 2020 / Published: 29 June 2020
(This article belongs to the Special Issue Surface Plasma Treatments)
In this study, we report on the investigation of influence of air atmospheric pressure dielectric barrier discharge on polyimide (Kapton) films. It is shown that plasma treatment causes a significant increase of Kapton wettability that is connected with alterations of its chemical composition (oxidation) induced by dielectric barrier discharge. Observed variations in the wettability of Kapton were also found to be accompanied by changes in the dynamics of water droplets drying on plasma-treated Kapton, namely by the reduction of the constant contact angle phase of the droplet drying. This effect may be ascribed to the higher surface heterogeneity of plasma-treated Kapton that causes pinning of the edges of drying droplet on the Kapton surface. Finally, the differences in wettability induced by the plasma treatment led to a different way, how the water condensates on the Kapton surface: while the condensing water forms large amount of small droplets on untreated Kapton, much bigger water structures were found on the Kapton exposed to atmospheric plasma.
Keywords: Kapton; dielectric barrier discharge; surface modification Kapton; dielectric barrier discharge; surface modification
MDPI and ACS Style

Khomiakova, N.; Hanuš, J.; Kuzminova, A.; Kylián, O. Investigation of Wettability, Drying and Water Condensation on Polyimide (Kapton) Films Treated by Atmospheric Pressure Air Dielectric Barrier Discharge. Coatings 2020, 10, 619.

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