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Journal: Coatings, 2020
Volume: 10
Number: 164
Article:
A New Alternative Electrochemical Process for a Pre-Deposited UPD-Mn Mediated the Growth of Cu(Mn) Film by Controlling the Time during the Cu-SLRR
Authors:
by
Jau-Shiung Fang, Yu-Fei Sie, Yi-Lung Cheng and Giin-Shan Chen
Link:
https://www.mdpi.com/2079-6412/10/2/164
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