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Nanomaterials
Volume 15
Issue 16
10.3390/nano15161261
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This is an early access version, the complete PDF, HTML, and XML versions will be available soon.
Article

Millisecond Laser Oblique Hole Processing of Alumina Ceramics

by
Yuyang Chen
1,
Xianshi Jia
1,*,
Zhou Li
2,
Chuan Guo
3,4,5,
Ranfei Guo
6,
Kai Li
1,
Cong Wang
1,
Wenda Cui
3,4,5,
Changqing Song
3,4,5,
Kai Han
3,4,5,* and
Ji’an Duan
1
1
State Key Laboratory of Precision Manufacturing for Extreme Service Performance, College of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China
2
School of Intelligent Manufacturing, Hunan First Normal University, Changsha 410221, China
3
College of Advanced Interdisciplinary Studies, National University of Defense Technology, Changsha 410083, China
4
Nanhu Laser Laboratory, National University of Defense Technology, Changsha 410083, China
5
Hunan Provincial Key Laboratory of High Energy Laser Technology, National University of Defense Technology, Changsha 410083, China
6
Bosch Automotive Products (Changsha) Co., Ltd., No.26, Lixiang Road Middle, Changsha 410100, China
*
Authors to whom correspondence should be addressed.
Nanomaterials 2025, 15(16), 1261; https://doi.org/10.3390/nano15161261
Submission received: 13 June 2025 / Revised: 23 July 2025 / Accepted: 4 August 2025 / Published: 15 August 2025
(This article belongs to the Special Issue Advanced Laser Manufacturing: Preparation of Functional Nanostructures and Synthesis of Nanomaterials)
Versions Notes

Abstract

Alumina ceramic substrates are ideal materials for next-generation microelectronic systems and devices, widely used in aerospace, 5G communications, and LED lighting. High-quality hole processing is essential for system interconnection and device packaging. Millisecond lasers have emerged as a promising choice for hole processing in alumina ceramic due to their high processing efficiency. However, existing research has rarely explored the mechanisms and processing techniques of millisecond laser oblique hole formation. This study systematically investigates the dynamic evolution of oblique hole processing in alumina ceramic through theoretical simulations, online detection, and process experiments. Through the simulation model, we have established the relationship between material temperature and hole depth. By analyzing the ablation phenomena on the upper and lower surfaces of the ceramic during the transient interaction process between the millisecond laser and the ceramic, the material removal mechanism in this process is elucidated. Additionally, this study examines the millisecond laser oblique hole processing technology by analyzing the influence of various laser parameters on hole formation. It reveals that appropriately increasing the single-pulse energy of millisecond lasers can optimize the material removal rate and hole taper. Ultimately, the formation mechanism of millisecond laser oblique hole processing in alumina ceramics is comprehensively summarized. The results provide theoretical and methodological guidance for high-speed laser drilling of alumina ceramic substrates.
Keywords: alumina ceramic; millisecond laser; laser drilling; in situ imaging; theoretical simulation; defects control alumina ceramic; millisecond laser; laser drilling; in situ imaging; theoretical simulation; defects control

Share and Cite

MDPI and ACS Style

Chen, Y.; Jia, X.; Li, Z.; Guo, C.; Guo, R.; Li, K.; Wang, C.; Cui, W.; Song, C.; Han, K.; et al. Millisecond Laser Oblique Hole Processing of Alumina Ceramics. Nanomaterials 2025, 15, 1261. https://doi.org/10.3390/nano15161261

AMA Style

Chen Y, Jia X, Li Z, Guo C, Guo R, Li K, Wang C, Cui W, Song C, Han K, et al. Millisecond Laser Oblique Hole Processing of Alumina Ceramics. Nanomaterials. 2025; 15(16):1261. https://doi.org/10.3390/nano15161261

Chicago/Turabian Style

Chen, Yuyang, Xianshi Jia, Zhou Li, Chuan Guo, Ranfei Guo, Kai Li, Cong Wang, Wenda Cui, Changqing Song, Kai Han, and et al. 2025. "Millisecond Laser Oblique Hole Processing of Alumina Ceramics" Nanomaterials 15, no. 16: 1261. https://doi.org/10.3390/nano15161261

APA Style

Chen, Y., Jia, X., Li, Z., Guo, C., Guo, R., Li, K., Wang, C., Cui, W., Song, C., Han, K., & Duan, J. (2025). Millisecond Laser Oblique Hole Processing of Alumina Ceramics. Nanomaterials, 15(16), 1261. https://doi.org/10.3390/nano15161261

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