Article Versions Notes

Jeon M-U, Kim P-S, Han M-H, Lee S-H, Lee H-M, Kim S-B, Park J-H, Cho K-C, Park J, Park J-G. Effects of Hydrolysis Reaction and Abrasive Drag Force Accelerator on Enhancing Si-Wafer Polishing Rate and Improving Si-Wafer Surface Roughness. Nanomaterials. 2025; 15(16):1248. https://doi.org/10.3390/nano15161248

Jeon, Min-Uk, Pil-Su Kim, Man-Hyup Han, Se-Hui Lee, Hye-Min Lee, Su-Bin Kim, Jin-Hyung Park, Kyoo-Chul Cho, Jinsub Park, and Jea-Gun Park. 2025. "Effects of Hydrolysis Reaction and Abrasive Drag Force Accelerator on Enhancing Si-Wafer Polishing Rate and Improving Si-Wafer Surface Roughness" Nanomaterials 15, no. 16: 1248. https://doi.org/10.3390/nano15161248

Jeon, M.-U., Kim, P.-S., Han, M.-H., Lee, S.-H., Lee, H.-M., Kim, S.-B., Park, J.-H., Cho, K.-C., Park, J., & Park, J.-G. (2025). Effects of Hydrolysis Reaction and Abrasive Drag Force Accelerator on Enhancing Si-Wafer Polishing Rate and Improving Si-Wafer Surface Roughness. Nanomaterials, 15(16), 1248. https://doi.org/10.3390/nano15161248