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Journal: Nanomaterials, 2023
Volume: 13
Number: 2154

Article: Improved Through-Plane Thermal Conductivity of Poly(dimethylsiloxane)Composites through the Formation of 3D Filler Foam Using Freeze-Casting and Annealing Processes
Authors: by Jooyoung Lee, Wonyoung Yang, Geunhyeong Lee, Youngsung Cho and Jooheon Kim
Link: https://www.mdpi.com/2079-4991/13/15/2154

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