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Journal: Nanomaterials, 2022
Volume: 12
Number: 3963
3963
Article: Characterization of an Etch Profile at a Wafer Edge in Capacitively Coupled Plasma
Authors: by Inho Seong, Jinho Lee, Sijun Kim, Youngseok Lee, Chulhee Cho, Jangjae Lee, Wonnyoung Jeong, Yebin You and Shinjae You
Link: https://www.mdpi.com/2079-4991/12/22/3963

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