Zhao, L.; Duan, G.; Zhang, G.; Yang, H.; He, S.; Jiang, S.
Electrospun Functional Materials toward Food Packaging Applications: A Review. Nanomaterials 2020, 10, 150.
https://doi.org/10.3390/nano10010150
AMA Style
Zhao L, Duan G, Zhang G, Yang H, He S, Jiang S.
Electrospun Functional Materials toward Food Packaging Applications: A Review. Nanomaterials. 2020; 10(1):150.
https://doi.org/10.3390/nano10010150
Chicago/Turabian Style
Zhao, Luying, Gaigai Duan, Guoying Zhang, Haoqi Yang, Shuijian He, and Shaohua Jiang.
2020. "Electrospun Functional Materials toward Food Packaging Applications: A Review" Nanomaterials 10, no. 1: 150.
https://doi.org/10.3390/nano10010150
APA Style
Zhao, L., Duan, G., Zhang, G., Yang, H., He, S., & Jiang, S.
(2020). Electrospun Functional Materials toward Food Packaging Applications: A Review. Nanomaterials, 10(1), 150.
https://doi.org/10.3390/nano10010150