Luo, J.; Wu, Y.; Sun, Y.; Wang, G.; Liu, Y.; Zhao, X.; Ding, G.
Preparation and Characterization of High Thermal Conductivity and Low CTE Polyimide Composite Reinforced with Diamond Nanoparticles/SiC Whiskers for 3D IC Interposer RDL Dielectric. Appl. Sci. 2019, 9, 1962.
https://doi.org/10.3390/app9091962
AMA Style
Luo J, Wu Y, Sun Y, Wang G, Liu Y, Zhao X, Ding G.
Preparation and Characterization of High Thermal Conductivity and Low CTE Polyimide Composite Reinforced with Diamond Nanoparticles/SiC Whiskers for 3D IC Interposer RDL Dielectric. Applied Sciences. 2019; 9(9):1962.
https://doi.org/10.3390/app9091962
Chicago/Turabian Style
Luo, Jiangbo, Yongpeng Wu, Yunna Sun, Guilian Wang, Yanmei Liu, Xiaolin Zhao, and Guifu Ding.
2019. "Preparation and Characterization of High Thermal Conductivity and Low CTE Polyimide Composite Reinforced with Diamond Nanoparticles/SiC Whiskers for 3D IC Interposer RDL Dielectric" Applied Sciences 9, no. 9: 1962.
https://doi.org/10.3390/app9091962
APA Style
Luo, J., Wu, Y., Sun, Y., Wang, G., Liu, Y., Zhao, X., & Ding, G.
(2019). Preparation and Characterization of High Thermal Conductivity and Low CTE Polyimide Composite Reinforced with Diamond Nanoparticles/SiC Whiskers for 3D IC Interposer RDL Dielectric. Applied Sciences, 9(9), 1962.
https://doi.org/10.3390/app9091962