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Appl. Sci. 2019, 9(3), 534; https://doi.org/10.3390/app9030534

Microstructure of Joint between Stranded Wire and Substrate Welded by Ultrasonic Welding

1
Department of Materials Science and Engineering, Ibaraki University, 4-12-1 Nakanarusawa, Hitachi, Ibaraki 316-8511, Japan
2
Dai-ichi Seiko Co., LTD., Machida ST Bldg., 1-33-10 Morino, Machida-City, Tokyo 194-0022, Japan
3
Ultrasonic Engineering Co., LTD., 1-6-1 Kashiwa-cho, Tachikawa, Tokyo 190-8522, Japan
*
Author to whom correspondence should be addressed.
Received: 31 December 2018 / Revised: 30 January 2019 / Accepted: 1 February 2019 / Published: 5 February 2019
(This article belongs to the Special Issue Selected Papers from the NMJ2018)
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Abstract

In order to improvement electronic and mechanical properties, welding between stranded wires and terminals is important. However, welding methods to obtain high-quality joints using stranded wires are still limited. In this report, we applied ultrasonic welding to join a Cu stranded wire to a Cu substrate. Cross-sections of the weldments were taken and observed by several microscopy techniques to elucidate the weldability and soundness of the joints. After ultrasonic welding, each wire in the stranded wire was joined together at the region where the stranded wire was joined to the substrate without any defect. Each wire was welded through the Ag coating layer, and the stranded wire and the substrate was also welded through the outermost coating layers. It was found that ultrasonic welding is an efficient technique for producing high quality joints without any defect at the interface. View Full-Text
Keywords: stranded wire; stranded conductor; ultrasonic welding; wedge bonding; electron back scattered diffraction pattern; microstructure; transmission electron microscopy; Cu wire stranded wire; stranded conductor; ultrasonic welding; wedge bonding; electron back scattered diffraction pattern; microstructure; transmission electron microscopy; Cu wire
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Iwamoto, C.; Yamauchi, K.; Motomura, K.; Hashimoto, Y.; Hamada, K. Microstructure of Joint between Stranded Wire and Substrate Welded by Ultrasonic Welding. Appl. Sci. 2019, 9, 534.

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