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Journal: Appl. Sci., 2019
Volume: 9
Number: 227
Article:
Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging
Authors:
by
Shaobin Wang, Yao Yao and Xu Long
Link:
https://www.mdpi.com/2076-3417/9/2/227
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