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Article
Peer-Review Record

Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal Aging

Appl. Sci. 2019, 9(1), 157; https://doi.org/10.3390/app9010157
by Hiroaki Tatsumi 1,2,*, Adrian Lis 2, Hiroshi Yamaguchi 1, Tomoki Matsuda 2, Tomokazu Sano 2, Yoshihiro Kashiba 2 and Akio Hirose 2
Reviewer 1: Anonymous
Reviewer 2: Anonymous
Appl. Sci. 2019, 9(1), 157; https://doi.org/10.3390/app9010157
Submission received: 19 December 2018 / Accepted: 27 December 2018 / Published: 4 January 2019
(This article belongs to the Special Issue Selected Papers from the NMJ2018)

Round 1

Reviewer 1 Report

This paper is well written. It is recommended that it should be considered for publication.



Reviewer 2 Report

The current paper properly and clear presents the nice research you have done. The introduction contains a relevant literature survey supported by references. Experimental procedure explanation is sufficiently detailed and clear. Results presentation and discussion is straight forward. The conclusions you have done well supported by the reported results. I think, you paper is of high scientific level and high professional interest, and then I recommend to publish it in the present form.

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