Article Versions Notes

Radamson HH, Zhang Y, He X, Cui H, Li J, Xiang J, Liu J, Gu S, Wang G. The Challenges of Advanced CMOS Process from 2D to 3D. Applied Sciences. 2017; 7(10):1047. https://doi.org/10.3390/app7101047

Radamson, Henry H., Yanbo Zhang, Xiaobin He, Hushan Cui, Junjie Li, Jinjuan Xiang, Jinbiao Liu, Shihai Gu, and Guilei Wang. 2017. "The Challenges of Advanced CMOS Process from 2D to 3D" Applied Sciences 7, no. 10: 1047. https://doi.org/10.3390/app7101047

Radamson, H. H., Zhang, Y., He, X., Cui, H., Li, J., Xiang, J., Liu, J., Gu, S., & Wang, G. (2017). The Challenges of Advanced CMOS Process from 2D to 3D. Applied Sciences, 7(10), 1047. https://doi.org/10.3390/app7101047