Li, Y.; Li, H.; Chen, W.; Yang, W.; Gu, Z.; Liu, B.
Heat Transfer on an Internal Thermal Insulation Structure for a High-Temperature Device: Numerical Simulation and Experiment. Appl. Sci. 2026, 16, 2132.
https://doi.org/10.3390/app16042132
AMA Style
Li Y, Li H, Chen W, Yang W, Gu Z, Liu B.
Heat Transfer on an Internal Thermal Insulation Structure for a High-Temperature Device: Numerical Simulation and Experiment. Applied Sciences. 2026; 16(4):2132.
https://doi.org/10.3390/app16042132
Chicago/Turabian Style
Li, Yin, Haihua Li, Wanhua Chen, Wenguo Yang, Zhixu Gu, and Bowen Liu.
2026. "Heat Transfer on an Internal Thermal Insulation Structure for a High-Temperature Device: Numerical Simulation and Experiment" Applied Sciences 16, no. 4: 2132.
https://doi.org/10.3390/app16042132
APA Style
Li, Y., Li, H., Chen, W., Yang, W., Gu, Z., & Liu, B.
(2026). Heat Transfer on an Internal Thermal Insulation Structure for a High-Temperature Device: Numerical Simulation and Experiment. Applied Sciences, 16(4), 2132.
https://doi.org/10.3390/app16042132