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Journal: Appl. Sci., 2026
Volume: 16
Number: 949
949
Article: Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires
Authors: by Wenxiang Yang, Yong Zhang, Xianzhe Cheng, Xinyu Luo, Guanjun Liu, Jing Qiu and Kehong Lyu
Link: https://www.mdpi.com/2076-3417/16/2/949

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