Yang, W.; Zhang, Y.; Cheng, X.; Luo, X.; Liu, G.; Qiu, J.; Lyu, K.
Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires. Appl. Sci. 2026, 16, 949.
https://doi.org/10.3390/app16020949
AMA Style
Yang W, Zhang Y, Cheng X, Luo X, Liu G, Qiu J, Lyu K.
Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires. Applied Sciences. 2026; 16(2):949.
https://doi.org/10.3390/app16020949
Chicago/Turabian Style
Yang, Wenxiang, Yong Zhang, Xianzhe Cheng, Xinyu Luo, Guanjun Liu, Jing Qiu, and Kehong Lyu.
2026. "Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires" Applied Sciences 16, no. 2: 949.
https://doi.org/10.3390/app16020949
APA Style
Yang, W., Zhang, Y., Cheng, X., Luo, X., Liu, G., Qiu, J., & Lyu, K.
(2026). Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires. Applied Sciences, 16(2), 949.
https://doi.org/10.3390/app16020949
