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Journal: Appl. Sci., 2026
Volume: 16
Number: 6588

Article: Flexible Reliability Assessment of Electronic Components Under Complex Failure-Mode Scenarios
Authors: by Luis Carlos Méndez-González, Luis Alberto Rodríguez-Picón, Isidro Jesús González-Hernández, Iván Juan Carlos Pérez-Olguín and Vicente García
Link: https://www.mdpi.com/2076-3417/16/13/6588

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