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Article

Coupled Electromagnetic-Thermal Multiphysics Analysis and Design Optimization of a Microwave Kiln

by
Chawit Samakkarn
1,
Piyawong Poopanya
2 and
Jatuporn Thongsri
1,*
1
Computer Simulation in Engineering Research Group, Department of Manufacturing System Technology, School of Integrated Innovative Technology, King Mongkut’s Institute of Technology Ladkrabang, Bangkok 10520, Thailand
2
Program of Physics, Faculty of Science, Ubon Ratchathani Rajabhat University, Ubon Ratchathani 34000, Thailand
*
Author to whom correspondence should be addressed.
Appl. Sci. 2026, 16(10), 4722; https://doi.org/10.3390/app16104722
Submission received: 30 March 2026 / Revised: 27 April 2026 / Accepted: 7 May 2026 / Published: 9 May 2026

Abstract

This study presents a multiphysics investigation of a microwave kiln for the glass-casting process, focusing on the coupled interaction between electromagnetic heating and thermal responses. The kiln (SiC-based) was experimentally tested in a household 800 W, 2450 MHz microwave oven without rotation for 5 min, with temperatures recorded at key positions using thermocouples and verified by thermal imaging. The computational framework integrates ANSYS (2021R1) High-Frequency Structure Simulator (HFSS) for electromagnetic-field and heat-generation prediction with Transient Thermal Analysis (TTA) for time-dependent temperature distribution. Validation showed agreement between simulation and experiment of the final temperature, with most errors below 4%, confirming the model’s reliability. A parametric study revealed that a thin SiC susceptor layer (1.5–2.0 mm) improves heat generation and temperature uniformity, while excessive thickness reduces heating efficiency. The optimized design improved the temperature by 2.58% compared with the original configuration at 800 W and achieved up to 38.44% improvement under specific operating conditions. These findings demonstrate that the proposed multiphysics method can support future development of small-scale glass-casting systems and sustainable recycled-glass production. Consequently, the work paves the way to Sustainable Development Goals (SDGs).
Keywords: high-frequency structure simulator; microwave kiln; multiphysics; sustainable development goals (SDGs); transient thermal analysis high-frequency structure simulator; microwave kiln; multiphysics; sustainable development goals (SDGs); transient thermal analysis

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MDPI and ACS Style

Samakkarn, C.; Poopanya, P.; Thongsri, J. Coupled Electromagnetic-Thermal Multiphysics Analysis and Design Optimization of a Microwave Kiln. Appl. Sci. 2026, 16, 4722. https://doi.org/10.3390/app16104722

AMA Style

Samakkarn C, Poopanya P, Thongsri J. Coupled Electromagnetic-Thermal Multiphysics Analysis and Design Optimization of a Microwave Kiln. Applied Sciences. 2026; 16(10):4722. https://doi.org/10.3390/app16104722

Chicago/Turabian Style

Samakkarn, Chawit, Piyawong Poopanya, and Jatuporn Thongsri. 2026. "Coupled Electromagnetic-Thermal Multiphysics Analysis and Design Optimization of a Microwave Kiln" Applied Sciences 16, no. 10: 4722. https://doi.org/10.3390/app16104722

APA Style

Samakkarn, C., Poopanya, P., & Thongsri, J. (2026). Coupled Electromagnetic-Thermal Multiphysics Analysis and Design Optimization of a Microwave Kiln. Applied Sciences, 16(10), 4722. https://doi.org/10.3390/app16104722

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