Next Article in Journal
Dynamic UAV Inspection Boosted by Vehicle Collaboration Under Harsh Conditions in the IoT Realm
Previous Article in Journal
Evaluation of Leakage Currents of Semiconductor Packages Due to High-Voltage Stress Under an Immersion Cooling Environment
 
 
Article

Article Versions Notes

Appl. Sci. 2025, 15(9), 4669; https://doi.org/10.3390/app15094669
Action Date Notes Link
article xml file uploaded 23 April 2025 14:51 CEST Original file -
article xml uploaded. 23 April 2025 14:51 CEST Update https://www.mdpi.com/2076-3417/15/9/4669/xml
article pdf uploaded. 23 April 2025 14:51 CEST Version of Record https://www.mdpi.com/2076-3417/15/9/4669/pdf
article html file updated 23 April 2025 14:52 CEST Original file https://www.mdpi.com/2076-3417/15/9/4669/html
Back to TopTop