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Journal: Appl. Sci., 2025
Volume: 15
Number: 9473
9473
Article: Thermal Performance Analysis and Structural Optimization of Main Functional Components of Computers
Authors: by Tengyue Pan, Chengming Jiang, Xinmin Shen, Qin Yin, Xiaocui Yang, Wenqiang Peng, Chunhua Zhou, Xiangpo Zhang, Jinhong Xue and Enshuai Wang
Link: https://www.mdpi.com/2076-3417/15/17/9473

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