Pan, T.; Jiang, C.; Shen, X.; Yin, Q.; Yang, X.; Peng, W.; Zhou, C.; Zhang, X.; Xue, J.; Wang, E.
Thermal Performance Analysis and Structural Optimization of Main Functional Components of Computers. Appl. Sci. 2025, 15, 9473.
https://doi.org/10.3390/app15179473
AMA Style
Pan T, Jiang C, Shen X, Yin Q, Yang X, Peng W, Zhou C, Zhang X, Xue J, Wang E.
Thermal Performance Analysis and Structural Optimization of Main Functional Components of Computers. Applied Sciences. 2025; 15(17):9473.
https://doi.org/10.3390/app15179473
Chicago/Turabian Style
Pan, Tengyue, Chengming Jiang, Xinmin Shen, Qin Yin, Xiaocui Yang, Wenqiang Peng, Chunhua Zhou, Xiangpo Zhang, Jinhong Xue, and Enshuai Wang.
2025. "Thermal Performance Analysis and Structural Optimization of Main Functional Components of Computers" Applied Sciences 15, no. 17: 9473.
https://doi.org/10.3390/app15179473
APA Style
Pan, T., Jiang, C., Shen, X., Yin, Q., Yang, X., Peng, W., Zhou, C., Zhang, X., Xue, J., & Wang, E.
(2025). Thermal Performance Analysis and Structural Optimization of Main Functional Components of Computers. Applied Sciences, 15(17), 9473.
https://doi.org/10.3390/app15179473