Han, D.; Fan, H.; Yan, C.; Wang, T.; Yang, Y.; Ali, S.; Wang, G.
Heat Conduction and Cracking of Functionally Graded Materials Using an FDEM-Based Thermo-Mechanical Coupling Model. Appl. Sci. 2022, 12, 12279.
https://doi.org/10.3390/app122312279
AMA Style
Han D, Fan H, Yan C, Wang T, Yang Y, Ali S, Wang G.
Heat Conduction and Cracking of Functionally Graded Materials Using an FDEM-Based Thermo-Mechanical Coupling Model. Applied Sciences. 2022; 12(23):12279.
https://doi.org/10.3390/app122312279
Chicago/Turabian Style
Han, Du, Hongwei Fan, Chengzeng Yan, Tie Wang, Yu Yang, Sajid Ali, and Gang Wang.
2022. "Heat Conduction and Cracking of Functionally Graded Materials Using an FDEM-Based Thermo-Mechanical Coupling Model" Applied Sciences 12, no. 23: 12279.
https://doi.org/10.3390/app122312279
APA Style
Han, D., Fan, H., Yan, C., Wang, T., Yang, Y., Ali, S., & Wang, G.
(2022). Heat Conduction and Cracking of Functionally Graded Materials Using an FDEM-Based Thermo-Mechanical Coupling Model. Applied Sciences, 12(23), 12279.
https://doi.org/10.3390/app122312279