Order Article Reprints
Journal: Appl. Sci., 2020
Volume: 10
Number: 1951
Article:
Failure Analysis of SAC305 Ball Grid Array Solder Joint at Extremely Cryogenic Temperature
Authors:
by
Yanruoyue Li, Guicui Fu, Bo Wan, Maogong Jiang, Weifang Zhang and Xiaojun Yan
Link:
https://www.mdpi.com/2076-3417/10/6/1951
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.