Reprint
Reliability Analysis of Electrotechnical Devices
Edited by
July 2022
174 pages
- ISBN978-3-0365-4653-7 (Hardback)
- ISBN978-3-0365-4654-4 (PDF)
This book is a reprint of the Special Issue Reliability Analysis of Electrotechnical Devices that was published in
Biology & Life Sciences
Chemistry & Materials Science
Computer Science & Mathematics
Engineering
Environmental & Earth Sciences
Physical Sciences
Summary
This is a book on the practical approaches of reliability to electrotechnical devices and systems. It includes the electromagnetic effect, radiation effect, environmental effect, and the impact of the manufacturing process on electronic materials, devices, and boards.
Format
- Hardback
License
© 2022 by the authors; CC BY-NC-ND license
Keywords
3D-IC (three-dimensional integrated circuit); electromagnetic interference; near field measurement; SAC305; BGA; low temperature; fracture failure; factorial design of experiment; genetic algorithm optimization; return loss; electromagnetic interference; multiple-input multiple-output (MIMO); single event effects; linear energy transfer; Monte Carlo simulation; radiation hardness; pressureless sintered micron silver joints; deep space environment; extreme thermal shocks; reconstruction; simulation; elastic mechanical properties; state of health; remaining useful life; electrochemistry based electrical model; semi-empirical capacity fading model; useful life distribution; quality and reliability assurance; single event effect; Monte Carlo simulation; microdosimetry; linear energy transfer; lineal energy; deconvolution; gamma process; lifetime; measurement system analysis; reliability estimation; GaN; operational amplifier; proton therapy; prompt gamma imaging; 3D X-ray; bias temperature-humidity reliability test; conductive anodic filament (CAF); de-penalization; finite element analysis; n/a