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Journal: Applied SciencesVolume: 10Number: 8516
Article: Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics
  • Authors:
  • Maximilian Schmid*,
  • Sri Krishna Bhogaraju and
  • E Liu
  • et al.
Link: https://www.mdpi.com/2076-3417/10/23/8516

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