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Journal: Appl. Sci., 2020
Volume: 10
Number: 8516

Article: Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics
Authors: by Maximilian Schmid, Sri Krishna Bhogaraju, E Liu and Gordon Elger
Link: https://www.mdpi.com/2076-3417/10/23/8516

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