Morese, S.; Nalli, K.P.; Telrandhe, A.; Subhash, S.K.; Kundu, S.; Goldschmidtböing, F.; Pelz, U.; Woias, P.
Quasi-Monolithic All-in-One TEG-PCM Systems: Reducing Thermal Interfaces via Multilayer PCB Technology. Actuators 2026, 15, 239.
https://doi.org/10.3390/act15050239
AMA Style
Morese S, Nalli KP, Telrandhe A, Subhash SK, Kundu S, Goldschmidtböing F, Pelz U, Woias P.
Quasi-Monolithic All-in-One TEG-PCM Systems: Reducing Thermal Interfaces via Multilayer PCB Technology. Actuators. 2026; 15(5):239.
https://doi.org/10.3390/act15050239
Chicago/Turabian Style
Morese, Stefano, Kiran Paul Nalli, Abhijit Telrandhe, Swathi Krishna Subhash, Suman Kundu, Frank Goldschmidtböing, Uwe Pelz, and Peter Woias.
2026. "Quasi-Monolithic All-in-One TEG-PCM Systems: Reducing Thermal Interfaces via Multilayer PCB Technology" Actuators 15, no. 5: 239.
https://doi.org/10.3390/act15050239
APA Style
Morese, S., Nalli, K. P., Telrandhe, A., Subhash, S. K., Kundu, S., Goldschmidtböing, F., Pelz, U., & Woias, P.
(2026). Quasi-Monolithic All-in-One TEG-PCM Systems: Reducing Thermal Interfaces via Multilayer PCB Technology. Actuators, 15(5), 239.
https://doi.org/10.3390/act15050239
