Quasi-Monolithic All-in-One TEG-PCM Systems: Reducing Thermal Interfaces via Multilayer PCB Technology
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Morese, S.; Nalli, K.P.; Telrandhe, A.; Subhash, S.K.; Kundu, S.; Goldschmidtböing, F.; Pelz, U.; Woias, P. Quasi-Monolithic All-in-One TEG-PCM Systems: Reducing Thermal Interfaces via Multilayer PCB Technology. Actuators 2026, 15, 239. https://doi.org/10.3390/act15050239
Morese S, Nalli KP, Telrandhe A, Subhash SK, Kundu S, Goldschmidtböing F, Pelz U, Woias P. Quasi-Monolithic All-in-One TEG-PCM Systems: Reducing Thermal Interfaces via Multilayer PCB Technology. Actuators. 2026; 15(5):239. https://doi.org/10.3390/act15050239
Chicago/Turabian StyleMorese, Stefano, Kiran Paul Nalli, Abhijit Telrandhe, Swathi Krishna Subhash, Suman Kundu, Frank Goldschmidtböing, Uwe Pelz, and Peter Woias. 2026. "Quasi-Monolithic All-in-One TEG-PCM Systems: Reducing Thermal Interfaces via Multilayer PCB Technology" Actuators 15, no. 5: 239. https://doi.org/10.3390/act15050239
APA StyleMorese, S., Nalli, K. P., Telrandhe, A., Subhash, S. K., Kundu, S., Goldschmidtböing, F., Pelz, U., & Woias, P. (2026). Quasi-Monolithic All-in-One TEG-PCM Systems: Reducing Thermal Interfaces via Multilayer PCB Technology. Actuators, 15(5), 239. https://doi.org/10.3390/act15050239

