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Open AccessArticle

Nanoscale Hierarchical Structure of Twins in Nanograins Embedded with Twins and the Strengthening Effect

1
Institute of Innovative Research, Tokyo Institute of Technology, Yokohama 226-8503, Japan
2
School of Materials and Chemical Technology, Tokyo Institute of Technology, Yokohama 226-8503, Japan
3
National Institute of Advanced Industrial Science and Technology, Tsukuba Ibaraki 305-8564, Japan
*
Authors to whom correspondence should be addressed.
Metals 2019, 9(9), 987; https://doi.org/10.3390/met9090987
Received: 6 August 2019 / Revised: 4 September 2019 / Accepted: 5 September 2019 / Published: 6 September 2019
(This article belongs to the Special Issue Dislocation Mechanics of Metal Plasticity and Fracturing)
Hierarchical structures of 20 nm grains embedded with twins are realized in electrodeposited Au–Cu alloys. The electrodeposition method allows refinement of the average grain size to 20 nm order, and the alloying stabilizes the nanoscale grain structure. Au–Cu alloys are face-centered cubic (FCC) metals with low stacking fault energy that favors formation of growth twins. Due to the hierarchical structure, the Hall–Petch relationship is still observed when the crystalline size (average twin space) is refined to sub 10 nm region. The yield strength reaches 1.50 GPa in an electrodeposited Au–Cu alloy composed of 16.6 ± 1.1 nm grains and the average twin spacing at 4.7 nm. View Full-Text
Keywords: nanotwin; nanograin; Au–Cu alloy; micro-compression; yield strength nanotwin; nanograin; Au–Cu alloy; micro-compression; yield strength
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Tang, H.; Chang, T.-F.M.; Chai, Y.-W.; Chen, C.-Y.; Nagoshi, T.; Yamane, D.; Ito, H.; Machida, K.; Masu, K.; Sone, M. Nanoscale Hierarchical Structure of Twins in Nanograins Embedded with Twins and the Strengthening Effect. Metals 2019, 9, 987.

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