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Journal: Metals, 2019
Volume: 9
Number: 518
518
Article: The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading
Authors: by Congcong Cao, Keke Zhang, Baojin Shi, Huigai Wang, Di Zhao, Mengmeng Sun and Chao Zhang
Link: https://www.mdpi.com/2075-4701/9/5/518

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