Cao, C.; Zhang, K.; Shi, B.; Wang, H.; Zhao, D.; Sun, M.; Zhang, C.
The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading. Metals 2019, 9, 518.
https://doi.org/10.3390/met9050518
AMA Style
Cao C, Zhang K, Shi B, Wang H, Zhao D, Sun M, Zhang C.
The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading. Metals. 2019; 9(5):518.
https://doi.org/10.3390/met9050518
Chicago/Turabian Style
Cao, Congcong, Keke Zhang, Baojin Shi, Huigai Wang, Di Zhao, Mengmeng Sun, and Chao Zhang.
2019. "The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading" Metals 9, no. 5: 518.
https://doi.org/10.3390/met9050518
APA Style
Cao, C., Zhang, K., Shi, B., Wang, H., Zhao, D., Sun, M., & Zhang, C.
(2019). The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading. Metals, 9(5), 518.
https://doi.org/10.3390/met9050518