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Journal: Metals, 2018
Volume: 8
Number: 42
42
Article: Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers
Authors: by Shuye Zhang, Ming Yang, Mingliang Jin, Wen-Can Huang, Tiesong Lin, Peng He, Panpan Lin and Kyung-Wook Paik
Link: https://www.mdpi.com/2075-4701/8/1/42

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