Study of Surface Metallization of Polyimide Film and Interfacial Characterization
Abstract
:1. Introduction
2. Experimental Procedures
2.1. Materials
2.2. Metallization Process of PI
2.3. Characterization
2.3.1. Imide-Ring Opening Reaction and Contact Angle
2.3.2. Surface and Cross-Sectional Microstructures of Ni-Metallized PI Film
2.3.3. Peel Strength Test
3. Results and Discussion
3.1. ATR-FTIR and Contact Angle Analyses of KOH-Treated PI Films
3.2. Surface Metallization of PI Film
3.3. Cross-Sectional Characterization of Metallized PI Film
3.4. Pull-Off Examination of Metallized Layer on PI Film
4. Conclusions
Acknowledgments
Author Contributions
Conflicts of Interest
References
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KOH (M) | Transmittance (%) | Transmittance/Absorbance | A1720/A1500 | Relative Surface Imide Content (%) | Contact Angle (°) | ||
---|---|---|---|---|---|---|---|
1720 cm−1 | 1500 cm−1 | 1720 cm−1 | 1500 cm−1 | ||||
0 | 87.35 | 88.85 | 0.8735/0.0587 | 0.8885/0.0513 | 1.144 | 100 | 80.06 |
0.1 | 87.63 | 89.04 | 0.8763/0.0573 | 0.8904/0.0504 | 1.137 | 99.39 | 55.55 |
0.5 | 87.75 | 88.89 | 0.8775/0.0568 | 0.8889/0.0511 | 1.112 | 97.20 | 28.81 |
1 | 86.75 | 87.36 | 0.8675/0.0617 | 0.8736/0.0587 | 1.051 | 91.87 | 22.03 |
5 | 98.35 | 83.88 | 0.9835/0.0072 | 0.8388/0.0763 | 0.094 | 8.22 | 20.74 |
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Wu, P.-Y.; Lin, C.-H.; Chen, C.-M. Study of Surface Metallization of Polyimide Film and Interfacial Characterization. Metals 2017, 7, 189. https://doi.org/10.3390/met7060189
Wu P-Y, Lin C-H, Chen C-M. Study of Surface Metallization of Polyimide Film and Interfacial Characterization. Metals. 2017; 7(6):189. https://doi.org/10.3390/met7060189
Chicago/Turabian StyleWu, Pei-Yu, Ching-Hsuan Lin, and Chih-Ming Chen. 2017. "Study of Surface Metallization of Polyimide Film and Interfacial Characterization" Metals 7, no. 6: 189. https://doi.org/10.3390/met7060189