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Journal: Metals, 2021
Volume: 11
Number: 2041
Article:
Simulation for Cu Atom Diffusion Leading to Fluctuations in Solder Properties and Cu6Sn5 Growth during Multiple Reflows
Authors:
by
Min Shang, Chong Dong, Haoran Ma, Yunpeng Wang and Haitao Ma
Link:
https://www.mdpi.com/2075-4701/11/12/2041
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