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Journal: Metals, 2021
Volume: 11
Number: 2041

Article: Simulation for Cu Atom Diffusion Leading to Fluctuations in Solder Properties and Cu6Sn5 Growth during Multiple Reflows
Authors: by Min Shang, Chong Dong, Haoran Ma, Yunpeng Wang and Haitao Ma
Link: https://www.mdpi.com/2075-4701/11/12/2041

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