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Journal: Metals, 2021
Volume: 11
Number: 1537
1537
Article: Recent Advancements in AI-Enabled Smart Electronics Packaging for Structural Health Monitoring
Authors: by Vinamra Bhushan Sharma, Saurabh Tewari, Susham Biswas, Bharat Lohani, Umakant Dhar Dwivedi, Deepak Dwivedi, Ashutosh Sharma and Jae Pil Jung
Link: https://www.mdpi.com/2075-4701/11/10/1537

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