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Journal: Metals, 2020
Volume: 10
Number: 315

Article: Robust Ag-Cu Sintering Bonding at 160 °C via Combining Ag2O Microparticle Paste and Pt-Catalyzed Formic Acid Vapor
Authors: by Liangliang He, Junlong Li, Xin Wu, Fengwen Mu, Yinghui Wang, Yangting Lu and Tadatomo Suga
Link: https://www.mdpi.com/2075-4701/10/3/315

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