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Robust Ag-Cu Sintering Bonding at 160 °C via Combining Ag2O Microparticle Paste and Pt-Catalyzed Formic Acid Vapor

by Liangliang He 1,2,3,†, Junlong Li 1,2,3,†, Xin Wu 4, Fengwen Mu 5,6,*, Yinghui Wang 1,2,3,*, Yangting Lu 3 and Tadatomo Suga 3,5
1
Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China
2
University of Chinese Academy of Sciences, Beijing 100049, China
3
Kunshan Branch, Institute of Microelectronics of Chinese Academy of Sciences, Suzhou 100049, China
4
Department of Mechanical and Materials Engineering, College of Engineering and Applied Science, University of Cincinnati, Cincinnati, OH 45221, USA
5
Collaborative Research Center, Meisei University, Hino-shi, Tokyo 1918506, Japan
6
Kagami Memorial Research Institute for Materials Science and Technology, Waseda University, Shinjuku, Tokyo 1690051, Japan
*
Authors to whom correspondence should be addressed.
These authors contribute equally to this work.
Metals 2020, 10(3), 315; https://doi.org/10.3390/met10030315
Received: 9 February 2020 / Revised: 25 February 2020 / Accepted: 26 February 2020 / Published: 28 February 2020
(This article belongs to the Special Issue Advances in Characterization of Heterogeneous Metals/Alloys)
With the assistance of Pt-catalyzed formic acid vapor, robust Ag-Cu bonding was realized at an ultra-low temperature of 160 °C under 3 MPa for 30 min via the sintering of Ag nanoparticles in situ generated from Ag2O microparticles. The Cu oxide layer at the interface after bonding can be eliminated, which improves the bond strength and electrical conductivity of the joint. A metallic bond contact between the sintered Ag and the Cu substrate is obtained without interfacial solid solution and intermetallic phases, and the shear strength is comparable to previous bonding at a higher temperature. The bonding mechanisms were figured out by comparing the bonding with and without the Pt-catalyzed formic acid vapor. This ultra-low temperature Ag-Cu bonding method may create more flexibilities in the structure design and material selection for power device integration. View Full-Text
Keywords: sintering bonding; nanoparticles; Ag2O microparticle; interface; die attach sintering bonding; nanoparticles; Ag2O microparticle; interface; die attach
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He, L.; Li, J.; Wu, X.; Mu, F.; Wang, Y.; Lu, Y.; Suga, T. Robust Ag-Cu Sintering Bonding at 160 °C via Combining Ag2O Microparticle Paste and Pt-Catalyzed Formic Acid Vapor. Metals 2020, 10, 315.

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