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Journal: Machines, 2021
Volume: 9
Number: 284
Article:
Obtainment of Residual Stress Distribution from Surface Deformation under Continuity Constraints for Thinned Silicon Wafers
Authors:
by
Haijun Liu, Tao Yang, Jiang Han, Xiaoqing Tian, Shan Chen and Lei Lu
Link:
https://www.mdpi.com/2075-1702/9/11/284
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