Chen, D.; Yang, Y.; Wang, X.; Li, D.; Liang, Y.; Xu, C.
Thermal-Stress Coupling Optimization for Coaxial through Silicon Via. Symmetry 2023, 15, 264.
https://doi.org/10.3390/sym15020264
AMA Style
Chen D, Yang Y, Wang X, Li D, Liang Y, Xu C.
Thermal-Stress Coupling Optimization for Coaxial through Silicon Via. Symmetry. 2023; 15(2):264.
https://doi.org/10.3390/sym15020264
Chicago/Turabian Style
Chen, Dongdong, Yintang Yang, Xianglong Wang, Di Li, Yi Liang, and Changqing Xu.
2023. "Thermal-Stress Coupling Optimization for Coaxial through Silicon Via" Symmetry 15, no. 2: 264.
https://doi.org/10.3390/sym15020264
APA Style
Chen, D., Yang, Y., Wang, X., Li, D., Liang, Y., & Xu, C.
(2023). Thermal-Stress Coupling Optimization for Coaxial through Silicon Via. Symmetry, 15(2), 264.
https://doi.org/10.3390/sym15020264