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Journal: Polymers, 2025
Volume: 17
Number: 1507
1507
Article: Preparation of Phenolic Epoxy-Based Electronic Packaging Materials with High Thermal Conductivity by Creating an Interfacial Heat Conduction Network
Authors: by Minghao Ye, Jing Jiang, Lin Zhao, Hongyu Zhu, Junjie Wang, Zicai Sun, Dewei Zhang, Ming Li and Yagang Zhang
Link: https://www.mdpi.com/2073-4360/17/11/1507

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