Dentin Bond Integrity of Filled and Unfilled Resin Adhesive Enhanced with Silica Nanoparticles—An SEM, EDX, Micro-Raman, FTIR and Micro-Tensile Bond Strength Study
Abstract
:1. Introduction
2. Materials and Methods
2.1. Synthesis of EA
2.2. Procurement and Incorporation of Si Particles in EA
2.3. Characterization of Si Particles
2.4. Preparation of Tooth Samples
2.5. µ TBS Analysis
2.6. Investigation of Bonded Adhesive–Dentin Interface Using SEM Spectroscopy
2.7. Degree of Conversion Analysis
- Caliphatic = 1638 cm−1 absorption peak of cured resin;
- Caromatic = 1607 cm−1 absorption peak of cured resin;
- Ualiphatic = 1638 cm−1 absorption peak of uncured resin;
- Uaromatic = 1607 cm−1 absorption peak of uncured resin.
2.8. Statistical Analysis
3. Results
3.1. SEM-EDX Analysis Results
3.2. Micro-Raman Spectroscopy Results
3.3. µTBS and Failure Mode Analysis Results
3.4. FTIR and DC Analysis Results
4. Discussion
5. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
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μTBS (MPa) (Mean ± SD) | Failure Mode Analysis (%) | |||||
---|---|---|---|---|---|---|
Group (n = 10) | Non-Aged | Aged | p-Value * | Adhesive | Cohesive | Mixed |
1. Si-EA-0% (Control) | 24.62 ± 2.53 a A | - | <0.01 | 70 | 10 | 20 |
- | 20.77 ± 2.08 a B | 100 | 0 | 0 | ||
2. Si-EA-5% | 28.85 ± 2.53 b A | 80 | 0 | 20 | ||
- | 23.77 ± 2.49 a B | 100 | 0 | 0 | ||
3. Si-EA-10% | 34.36 ± 4.23 c A | 50 | 0 | 50 | ||
- | 27.07 ± 2.49 b B | 80 | 10 | 10 | ||
4. Si-EA-15% | 36.17 ± 3.31 c A | 70 | 0 | 30 | ||
- | 29.97 ± 4.18 b B | 100 | 0 | 0 |
Groups | DC (Mean ± SD) | Tukey’s | |
---|---|---|---|
1 | Si-EA-0% (UA-Control) | 48.2 ± 3.5 | A |
2 | Si-EA-5% | 47.4 ± 3.1 | A |
3 | Si-EA-10% | 41.9 ± 2.4 | B |
4 | Si-EA-15% | 37.6 ± 2.7 | B |
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Alhenaki, A.M.; Attar, E.A.; Alshahrani, A.; Farooq, I.; Vohra, F.; Abduljabbar, T. Dentin Bond Integrity of Filled and Unfilled Resin Adhesive Enhanced with Silica Nanoparticles—An SEM, EDX, Micro-Raman, FTIR and Micro-Tensile Bond Strength Study. Polymers 2021, 13, 1093. https://doi.org/10.3390/polym13071093
Alhenaki AM, Attar EA, Alshahrani A, Farooq I, Vohra F, Abduljabbar T. Dentin Bond Integrity of Filled and Unfilled Resin Adhesive Enhanced with Silica Nanoparticles—An SEM, EDX, Micro-Raman, FTIR and Micro-Tensile Bond Strength Study. Polymers. 2021; 13(7):1093. https://doi.org/10.3390/polym13071093
Chicago/Turabian StyleAlhenaki, Aasem M., Esra A. Attar, Abdullah Alshahrani, Imran Farooq, Fahim Vohra, and Tariq Abduljabbar. 2021. "Dentin Bond Integrity of Filled and Unfilled Resin Adhesive Enhanced with Silica Nanoparticles—An SEM, EDX, Micro-Raman, FTIR and Micro-Tensile Bond Strength Study" Polymers 13, no. 7: 1093. https://doi.org/10.3390/polym13071093