Lee, E.; Sun, K.; So, Y.; Baek, J.; Shin, J.H.; Kim, H.D.; Youn, Y.B.; Kim, M.-W.
Wettability-Controlled Hydrophobic Coating of CMP Component Using PTFE and DLC for Mitigating Slurry Agglomeration and Contamination. Micromachines 2025, 16, 1382.
https://doi.org/10.3390/mi16121382
AMA Style
Lee E, Sun K, So Y, Baek J, Shin JH, Kim HD, Youn YB, Kim M-W.
Wettability-Controlled Hydrophobic Coating of CMP Component Using PTFE and DLC for Mitigating Slurry Agglomeration and Contamination. Micromachines. 2025; 16(12):1382.
https://doi.org/10.3390/mi16121382
Chicago/Turabian Style
Lee, Eunseok, Kyoungjun Sun, Yuhan So, Jaewoo Baek, Jun Hyuk Shin, Hae Dong Kim, Yeo Bin Youn, and Min-Woo Kim.
2025. "Wettability-Controlled Hydrophobic Coating of CMP Component Using PTFE and DLC for Mitigating Slurry Agglomeration and Contamination" Micromachines 16, no. 12: 1382.
https://doi.org/10.3390/mi16121382
APA Style
Lee, E., Sun, K., So, Y., Baek, J., Shin, J. H., Kim, H. D., Youn, Y. B., & Kim, M.-W.
(2025). Wettability-Controlled Hydrophobic Coating of CMP Component Using PTFE and DLC for Mitigating Slurry Agglomeration and Contamination. Micromachines, 16(12), 1382.
https://doi.org/10.3390/mi16121382
