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Article

Effects of Process Parameters on Material Removal in Vibration-Assisted Polishing of Micro-Optic Mold

by 1,* and 2
1
Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China
2
Department of Mechanical Engineering, Chubu University, 1200 Matsumoto-cho, Kasugai, Aichi 487-8501, Japan
*
Author to whom correspondence should be addressed.
Micromachines 2018, 9(7), 349; https://doi.org/10.3390/mi9070349
Received: 22 May 2018 / Revised: 7 July 2018 / Accepted: 10 July 2018 / Published: 12 July 2018
(This article belongs to the Special Issue Micro-Machining: Challenges and Opportunities)
Process parameter conditions such as vibrating motion, abrasives, pressure and tool wear play an important role in vibration-assisted polishing of micro-optic molds as they strongly affect material removal efficiency and stability. This paper presents an analytical and experimental investigation on the effects of process parameters, aimed at clarifying interrelations between material removal and process parameters which affect polishing quantitatively. The material removal rate (MRR) and surface roughness which represent the polishing characteristics were examined under different vibrating motions, grain sizes of abrasives and polishing pressure. The effects of pressure and tool wear conditions on tool influence function were analyzed. The results showed that 2D vibrating motion generated better surface roughness with higher material removal efficiency while a smaller grain size of abrasives created better surface roughness but lower material removal efficiency. MRR gradually decreases with the increase of polishing pressure when it exceeds 345 kPa, and it was greatly affected by the wear of polisher when wear diameter on the polisher’s head exceeds 300 μm. View Full-Text
Keywords: polishing pressure; vibration; material removal; roughness; tungsten carbide; tool wear polishing pressure; vibration; material removal; roughness; tungsten carbide; tool wear
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MDPI and ACS Style

Guo, J.; Suzuki, H. Effects of Process Parameters on Material Removal in Vibration-Assisted Polishing of Micro-Optic Mold. Micromachines 2018, 9, 349. https://doi.org/10.3390/mi9070349

AMA Style

Guo J, Suzuki H. Effects of Process Parameters on Material Removal in Vibration-Assisted Polishing of Micro-Optic Mold. Micromachines. 2018; 9(7):349. https://doi.org/10.3390/mi9070349

Chicago/Turabian Style

Guo, Jiang; Suzuki, Hirofumi. 2018. "Effects of Process Parameters on Material Removal in Vibration-Assisted Polishing of Micro-Optic Mold" Micromachines 9, no. 7: 349. https://doi.org/10.3390/mi9070349

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